石墨烯基复合热界面材料导热性能研究进展

安盟; 孙旭辉; 陈东升; 杨诺

doi:10.7498/aps.71.20220306

摘要

随着微纳电子器件热功率密度的迅速增长, 控制其温度已成为电子信息产业发展和应用的迫切需求. 研发高性能热界面材料是热管理关键问题之一. 由于高导热特性，石墨烯基复合热界面材料成为研究热点. 从原子尺度深入理解复合体系中声子输运机理, 有助于提升复合体系导热性能. 本文从石墨烯内热阻和和复合体系界面热阻两方面介绍和讨论石墨烯复合体系导热的研究进展、导热机制以及调控方式. 最后对该方向研究成果和发展趋势进行总结和展望.

关键词:

Abstract

With the rapid increase of the thermal power density of microelectronic devices and circuits, controlling its temperature has become an urgent need for the development and application of the electronic industry. By virtue of the ultrahigh thermal conductivity of graphene, developing high-performance graphene-based composite thermal interface materials has attracted much research attention and become one of hot research topics. The understanding of phonon transport mechanism in graphene-based composites at atomic scale can be helpful to enhance the heat conductive capability of composites systems. In this review, focused on graphene-based thermal interfaces materials, the heat conduction mechanism and the regulating strategy are introduced on both the internal thermal resistance and interfacial thermal resistance. Finally, the reseach progress and opportunities for future studies are also summarized.

Keywords:

作者及机构信息

1.
陕西科技大学, 机电工程学院, 西安　710021

2.
华中科技大学能源与动力工程学院, 武汉　430074

通信作者: 安盟, anmeng@sust.edu.cn ; 杨诺, nuo@hust.edu.cn

基金项目: 国家自然科学基金(批准号: 52006130)和陕西省自然科学基金基础研究项目(批准号: 2020JQ-692)资助的课题.

Authors and contacts

1.
College of Mechanical & Electrical Engineering, Shaanxi University of Science and Technology, Xi’an 710021, China

2.
School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Corresponding author: An Meng, anmeng@sust.edu.cn ; Yang Nuo, nuo@hust.edu.cn

Funds: Project supported by the National Natural Science Foundation of China (Grant No. 52006130), and the Fundamental Research Funds for Shaanxi Province (Grant No. 2020JQ-692) .

文章全文 : translate this paragraph

参考文献

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施引文献

图 1 高功率密度集成电路散热示意图和热界面示意图

Fig. 1. The schematic diagram of high-power integrated chip for heat dissipation.

下载: 全尺寸图片幻灯片

图 2 (a) 石墨烯基复合体系中石墨烯面内振动(黑色箭头)和面外振动(红色箭头); (b) 复合体系中石墨烯内非平衡声子群温度; (c) 复合体系中界面石墨烯的面内振动(黑色箭头)和面外振动(红色箭头); (d) 界面石墨烯的非平衡声子温度

Fig. 2. (a), (c) The schematic diagram of two types of graphene-based composites where in-plane (out-of-plane) phonon group is denoted as black arrow (red arrow); (b), (d) the temperature distribution of in-plane phonon group, out-of-plane phonon group in graphene and polymer.

下载: 全尺寸图片幻灯片

图 3 (a) 面内异质结构和(c)范德瓦耳斯界面原子模型; (b) 面内异质界面和(d)范德瓦耳斯界面在沿热流方向的温度分布, 其中左边系统声子群A和B均对系统导热有贡献且存在非平衡现象, 右边系统仅有一种声子群

Fig. 3. (a) The atomic structure models of in-plane heterointerface and (c) van der Waals heterointerfaces;the temperature distribution of phonon group A(b), T_{A, left}, phonon group B(d), T_{B, left} in the left region and phonon group T_right in right region.

下载: 全尺寸图片幻灯片

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