Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stresses

Zhou Bin; Huang Yun; En Yun-Fei; Fu Zhi-Wei; Chen Si; Yao Ruo-He

doi:10.7498/aps.67.20171950

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Zhou Bin, Huang Yun, En Yun-Fei, Fu Zhi-Wei, Chen Si, Yao Ruo-He. Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stressesJ. Acta Physica Sinica, 2018, 67(2): 028101. DOI: 10.7498/aps.67.20171950

Citation:

Zhou Bin, Huang Yun, En Yun-Fei, Fu Zhi-Wei, Chen Si, Yao Ruo-He. Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stressesJ. Acta Physica Sinica, 2018, 67(2): 028101. DOI: 10.7498/aps.67.20171950

Citation:

Zhou Bin, Huang Yun, En Yun-Fei, Fu Zhi-Wei, Chen Si, Yao Ruo-He. Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stressesJ. Acta Physica Sinica, 2018, 67(2): 028101. DOI: 10.7498/aps.67.20171950