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In order to study the thermal transport properties of heterogeneous gallium nitride/graphene/silicon carbide interface, the effects of temperature, size and vacancy defects on the thermal conductance of the interface are investigated by non-equilibrium molecular dynamics method, and the effects of changes of phonon state density and phonon participation rate on the thermal conductance of the interface are further analyzed. The results show that the thermal conductance of the interface increases with temperature increasing. The analysis shows that as temperature rises, the lattice vibration intensity, the density of low frequency phonon states, and the number of phonons involved in heat transport all increase. The change of thermal conductance at the interface of single-layer graphene is higher than that of multi-layer graphene. When the structural size of the heat transport direction is changed and the number of layers of gallium nitride and silicon carbide are changed at the same time, the thermal conductance at the interface does not change significantly, and the phonon scattering of the thermal transport at the interface is almost unaffected. However, as the number of graphene interlayers increases from the first layer to the fifth layer, the interface thermal conductance first decreases and then slowly increases. Because of the fourth layer, the participation rate of low frequency phonons decreases, more phonons are localized, and the number of phonons that do not participate in heat transfer increases, and the interfacial thermal conductance reaches a minimum value of 0.024 GW/(m2·K). As the vacancy defect concentration increases, the interfacial thermal conductance first increases gradually and then decreases. The difference is that when the concentration of single vacancy defects is 10%, the interface thermal conductance reaches a maximum value of 0.063 GW/(m2·K). When the concentration of double vacancy defects is 12%, the interfacial thermal conductance reaches a maximum value of 0.065 GW/(m2·K). The analysis shows that more phonons enter into the delocalisation from the local region and more phonons participate in the heat transfer, leading to the increase of the interface thermal conductance. The results are useful in adjusting the thermal transport performance of GaN devices and provide a theoretical basis for designing the devices with heterogeneous interfaces.
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Keywords:
- heterogeneous interface thermal conductance /
- temperature effect /
- size effect /
- vacancy defect
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[19] Xu Y, Cao B, Li Z, Zheng S, Cai D, Wang M, Zhang Y, Wang J, Wang C, Xu K 2019 Cryst. Eng. Comm. 21 6109Google Scholar
[20] Hu M, Poulikakos D 2013 Int. J. Heat Mass Transfer 62 205Google Scholar
[21] Yang B, Yang H, Li T, Yang J, Yang P 2021 Appl. Surf. Sci. 536 147828Google Scholar
[22] 刘东静, 王韶铭, 杨平 2021 物理学报 70 187302Google Scholar
Liu D J, Wang S M, Yang P 2021 Acta Phys. Sin. 70 187302Google Scholar
[23] Xiong Y, Wu H, Gao J, Chen W, Zhang J, Yue Y 2019 Acta Phys. Chim. Sin. 35 1150Google Scholar
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[27] Stillinger F H, Weber T A 1985 Phys. Rev. B 31 5262Google Scholar
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[29] Li M, Zhang J C, Hu X J, Yue Y N 2015 Appl. Phys. A. 119 415Google Scholar
[30] Farago O 2019 Physica A 534 122210Google Scholar
[31] 叶振强, 曹炳阳, 过增元 2014 物理学报 63 154704Google Scholar
Ye Z Q, Cao B Y, Guo Z Y 2014 Acta Phys. Sin. 63 154704Google Scholar
[32] Han D, Wang X, Ding W, Chen Y, Zhang J, Xin G, Cheng L 2019 Nanotechnology 30 075403Google Scholar
[33] Guo Y, Bescond M, Zhang Z, Xiong S, Hirakawa K, Nomura M, Volz S 2021 APL Materials 9 091104Google Scholar
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表 1 LJ势函数参数
Table 1. Lennard-Jones parameter.
参数 $\varepsilon /{\text{eV}}$ σ/Å C-C 0.00455 3.851 Si-C 0.00891 4.073 Ga-C 0.00905 4.117 N-C 0.00617 3.757 Si-Ga 0.01771 4.339 Si-N 0.01207 3.979 -
[1] Lee J Y, Shin J H, Lee G H, Lee C H 2016 Nanomaterials (Basel) 6 193Google Scholar
[2] Liu Y, Fang Y, Yang D, Pi X, Wang P 2022 J. Phys. Condens. Matter. 34 183001Google Scholar
[3] Xu H, Akbari M K, Zhuiykov S 2021 Nanoscale Res. Lett. 16 94Google Scholar
[4] Islam M S, Mia I, Ahammed S, Stampfl C, Park J 2020 Sci. Rep. 10 22050Google Scholar
[5] Zanane F Z, Sadki K, Drissi L B, Saidi E H 2022 J. Mol. Model. 28 88Google Scholar
[6] Wu D, Ding H, Fan Z Q, Jia P Z, Xie H Q, Chen X K 2022 Appl. Surf. 581 152344Google Scholar
[7] Li M, Zheng B, Duan K, Zhang Y, Huang Z, Zhou H 2018 J. Phys. Chem. C 122 14945Google Scholar
[8] Littlejohn A J, Xiang Y, Rauch E, Lu T M, Wang G C 2017 J. Appl. Phys. 122 185305Google Scholar
[9] Utama M I B, de la Mata M, Magen C, Arbiol J, Xiong Q 2013 Adv. Funct. Mater. 23 1636Google Scholar
[10] Balandin A A 2011 Nat. Mater. 10 569Google Scholar
[11] Yan Z, Liu G, Khan J M, Balandin A A 2012 Nat. Commun. 3 827Google Scholar
[12] Kim Y, Cruz S S, Lee K, Alawode B O, Choi C, Song Y, Johnson J M, Heidelberger C, Kong W, Choi S, Qiao K, Almansouri I, Fitzgerald E A, Kong J, Kolpak A M, Hwang J, Kim J 2017 Nature 544 340Google Scholar
[13] Zollner C J, Almogbel A, Yao Y, SaifAddin B K, Wu F, Iza M, DenBaars S P, Speck J S, Nakamura S 2019 Appl. Phys. Lett. 115 161101Google Scholar
[14] Xu Y, Wang J, Cao B, Xu K 2022 Chin. Phys. B 31 117702Google Scholar
[15] Al Balushi Z Y, Miyagi T, Lin Y C, Wang K, Calderin L, Bhimanapati G, Redwing J M, Robinson J A 2015 Surf. Sci. 634 81Google Scholar
[16] Feldberg N, Klymov O, Garro N, Cros A, Mollard N, Okuno H, Gruart M, Daudin B 2019 Nanotechnology 30 375602Google Scholar
[17] Fernandez-Garrido S, Ramsteiner M, Gao G, Galves L A, Sharma B, Corfdir P, Calabrese G, de Souza Schiaber Z, Pfuller C, Trampert A, Lopes J M J, Brandt O, Geelhaar L 2017 Nano Lett. 17 5213Google Scholar
[18] Puybaret R, Patriarche G, Jordan M B, Sundaram S, El Gmili Y, Salvestrini J P, Voss P L, de Heer W A, Berger C, Ougazzaden A 2016 Appl. Phys. Lett. 108 103105Google Scholar
[19] Xu Y, Cao B, Li Z, Zheng S, Cai D, Wang M, Zhang Y, Wang J, Wang C, Xu K 2019 Cryst. Eng. Comm. 21 6109Google Scholar
[20] Hu M, Poulikakos D 2013 Int. J. Heat Mass Transfer 62 205Google Scholar
[21] Yang B, Yang H, Li T, Yang J, Yang P 2021 Appl. Surf. Sci. 536 147828Google Scholar
[22] 刘东静, 王韶铭, 杨平 2021 物理学报 70 187302Google Scholar
Liu D J, Wang S M, Yang P 2021 Acta Phys. Sin. 70 187302Google Scholar
[23] Xiong Y, Wu H, Gao J, Chen W, Zhang J, Yue Y 2019 Acta Phys. Chim. Sin. 35 1150Google Scholar
[24] Yang Y, Ma J, Yang J, Zhang Y 2022 ACS Appl. Mater. Interfaces 14 45742Google Scholar
[25] Teshome T, Datta A 2017 ACS Appl. Mater. Interfaces 9 34213Google Scholar
[26] Liu Z, Su Z, Li Q, Sun L, Zhang X, Yang Z, Liu X, Li Y, Yu F, Zhao X 2019 RSC Adv. 9 32226Google Scholar
[27] Stillinger F H, Weber T A 1985 Phys. Rev. B 31 5262Google Scholar
[28] Liu D J 2020 Phys. Lett. A. 384 126077Google Scholar
[29] Li M, Zhang J C, Hu X J, Yue Y N 2015 Appl. Phys. A. 119 415Google Scholar
[30] Farago O 2019 Physica A 534 122210Google Scholar
[31] 叶振强, 曹炳阳, 过增元 2014 物理学报 63 154704Google Scholar
Ye Z Q, Cao B Y, Guo Z Y 2014 Acta Phys. Sin. 63 154704Google Scholar
[32] Han D, Wang X, Ding W, Chen Y, Zhang J, Xin G, Cheng L 2019 Nanotechnology 30 075403Google Scholar
[33] Guo Y, Bescond M, Zhang Z, Xiong S, Hirakawa K, Nomura M, Volz S 2021 APL Materials 9 091104Google Scholar
[34] Schulz J 2003 J. Reprod. Infant. Psyc. 21 363Google Scholar
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