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可延展柔性无机微纳电子器件原理与研究进展

冯雪 陆炳卫 吴坚 林媛 宋吉舟 宋国锋 黄永刚

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可延展柔性无机微纳电子器件原理与研究进展

冯雪, 陆炳卫, 吴坚, 林媛, 宋吉舟, 宋国锋, 黄永刚

Review on stretchable and flexible inorganic electronics

Feng Xue, Lu Bing-Wei, Wu Jian, Lin Yuan, Song Ji-Zhou, Song Guo-Feng, Huang Yong-Gang
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  • 为适应下一代电子产品便携性、形状可变性、人体适用性等方面的进一步需求,近年来基于无机电子材料的可延展柔性电子技术成为全球电子产业界与学术界关注的新焦点. 与有机柔性电子学器件不同,可延展柔性无机电子器件指的是建立在柔性基底上的无机电子组件. 这种具有柔性的集成电路利用力学设计提供大变形,在保持无机脆性电子器件高性能和高可靠性的同时,具备形状可弯曲、可伸缩等柔性性能. 本文综述了近年来无机柔性电子器件的进展,包括力学设计原理、基于界面黏附的转印集成方法以及柔性大变形下的失效机理等,并展望了未来的应用和发展.
    In order to meet the further demand of the next-generation electronic devices in the transplantable, lightweight and portable performances, flexible and stretchable inorganic electronics attract much more attention in both industry and academia in recent years. Compared to organic electronics, stretchable and flexible inorganic electronics are fabricated with the integrated structures of inorganic components on complaint substrates, which own the stretchability and flexibility via mechanical design. Thus stretchable and flexible inorganic electronics have the high electron mobility and excellent conformability to non-planar environment subjected to large deformation. This paper reviews the recent progress on principle, design based on mechanics, integration based on transfer printing and the reliability analysis of stretchable and flexible inorganic electronics. Finally, the prospective is also described for future application in bioengineering and medicine.
    • 基金项目: 国家自然科学基金(批准号:11320101001,10820101048,11222220,10902059,11372272)和清华信息科学与技术国家实验室(筹)资助的课题.
    • Funds: Project supported by the National Natural Science Foundation of China (Grant Nos. 11320101001, 10820101048, 11222220, 10902059, 11372272), and the National Laboratory of Information Science and Technology of Tsinghua University.
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  • [1]

    Briseno A L, Tseng R J, Ling M M, Falcao E H L, Yang Y, Wudl F, Bao Z 2006 Adv. Mater. 18 2320

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    Khang D Y, Jiang H Q, Huang Y, Rogers J A 2006 Science 311 208

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    [4]

    Crone B, Dodabalapur A, Lin Y Y, Filas R W, Bao Z, LaDuca A, Sarpeshkar R, Katz H E, Li W 2000 Nature 403 521

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    Forrest S R 2004 Nature 428 911

    [6]

    McAlpine M C, Ahmad H, Wang D, Heath J R 2007 Nat. Mater. 6 379

    [7]

    Baca A J, Ahn J H, Sun Y G, Meitl M A, Menard E, Kim H S, Choi W M, Kim D H, Huang Y, Rogers J A 2008 Angew. Chem. Int. Ed. 47 5524

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    Sekitani T, Nakajima H, Maeda H, Fukushima T, Aida T, Hata K, Someya T 2009 Nat. Mater. 8 494

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    [11]

    Nicholson P G, Castro F A 2010 Nanotechnology 21 492001

    [12]

    Park S, Xiong Y, Kim R H, Elvikis P, Meitl M, Kim D H, Wu J, Yoon J, Yu C J, Liu Z, Huang Y, Hwang K C, Ferreira P, Li X L, Choquette K, Rogers J A 2009 Science 325 977

    [13]

    Kim H S, Brueckner E, Song J, Li Y H, Kim S, Lu C F, Sulkin J, Choquette K, Huang Y H, Nuzzo R G, Rogers J A 2011 Proc. Natl. Acad. Sci. USA 108 10072

    [14]

    Chen G, Craven M, Kim A, Munkholm A, Watanabe S, Camras M, Götz W, Steranka F 2008 Phys. Status.Solidi. A 205 1086

    [15]

    Kim S O, Lee K H, Kim G Y, Seo J H, Kim Y K, Yoon S S 2010 Synth. Met. 160 1259

    [16]

    Kim D H, Ahn J H, Choi W M, Kim H S, Kim T H, Song J, HuangY, Liu Z, Lu C, Rogers J A 2008 Science 320 507

    [17]

    Ko H C, Stoykovich M P, Song J, Malyarchuk V, Choi W M, Yu C J, Geddes J B Ⅲ, Xiao J, Wang S, Huang Y, Rogers J A 2008 Nature 454 748

    [18]

    Kim D H, Viventi J, Amsden J J, Xiao J, Vigeland L, Kim Y S, Blanco J A, Panilaitis B, Frechette E S, Contreras D, Kaplan D L, Omenetto F G, Huang Y, Hwang K C, Zakin M R, Litt B, Rogers J A 2010 Nat. Mater. 9 511

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    Yeo W H, Kim Y S, Lee J, Ameen A, Shi L, Li M, Wang S, Ma R, Jin S H, Kang Z, Huang Y, Rogers J A 2013 Adv. Mater. 25 2773

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    Kim D H, Lu N, Ma R, Kim Y S, Kim R H, Wang S, Wu J, Won S M, Tao H, Islam A, Yu K J, Kim T, Chowdhury R, Ying M, Xu L Z, Li M, Chung H J, Keum H, McCormick M, Liu P, Zhang Y W, Omenetto F G, Huang Y, Coleman T, Rogers J A 2011 Science 333 838

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    Kim D H, Lu N, Ghaffari R, Kim Y S, Lee S P, Xu L Z, Wu J, Kim R H, Song J, Liu Z, Viventi J, Graff B D, Elolampi B, Mansour M, Slepian M J, Huang S, Moss J D, Won S M, Huang Y, Litt B, Rogers J A 2011 Nat. Mater. 10 316

    [22]

    Xu S, Zhang Y H, Cho J, Lee J, Huang X, Jia L, Fan J A, Su Y, Su J, Zhang H, Cheng H, Lu B, Yu C J, Chuang C, Kim T, Song T, Shigeta K, Kang S, Dagdeviren C, Petrov I, Braun P V, Huang Y, Paik U, Rogers J A 2013 Nat. Commun. 2553 1

    [23]

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    [24]

    Huang Z Y, Hong W, Suo Z 2005 J. Mech. Phys. Solids 532 101

    [25]

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    Baca A J, Ahn J H, Sun Y, Meitl M A, Menard E, Kim H S, Choi W M, Kim D H, Huang Y, Rogers J A 2008 Angew. Chem. Int. Ed. 47 5524

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    Hsia K J, Huang Y, Menard E, Park J U, Zhou W, Rogers J A, Fulton J M 2005 Appl. Phys. Lett. 86 154106

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    Huang Y Y, Zhou W X, Hsia K J, Menard E, Park J U, Rogers J A, Alleyne A G 2005 Langmuir 21 8058

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    Feng X, Meitl M A, Bowen A M, Huang Y, Nuzzo R G, Rogers J A 2007 Langmuir 23 12555

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    Yurenka S 1962 J. Appl. Polym. Sci. 61 36

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出版历程
  • 收稿日期:  2013-09-25
  • 修回日期:  2013-10-22
  • 刊出日期:  2014-01-05

可延展柔性无机微纳电子器件原理与研究进展

  • 1. 清华大学航天航空学院, 应用力学教育部重点实验室, 北京 100084;
  • 2. 清华大学先进力学与材料中心, 北京 100084;
  • 3. 电子科技大学, 电子薄膜与集成器件国家重点实验室, 成都 610054;
  • 4. 美国迈阿密大学机械与航空工程系, 迈阿密, 佛罗里达 33146;
  • 5. 中科院半导体研究所, 集成光电子学国家重点联合实验室, 北京 100083;
  • 6. 美国西北大学机械工程系, 埃文斯顿, 伊利诺伊 60208
    基金项目: 

    国家自然科学基金(批准号:11320101001,10820101048,11222220,10902059,11372272)和清华信息科学与技术国家实验室(筹)资助的课题.

摘要: 为适应下一代电子产品便携性、形状可变性、人体适用性等方面的进一步需求,近年来基于无机电子材料的可延展柔性电子技术成为全球电子产业界与学术界关注的新焦点. 与有机柔性电子学器件不同,可延展柔性无机电子器件指的是建立在柔性基底上的无机电子组件. 这种具有柔性的集成电路利用力学设计提供大变形,在保持无机脆性电子器件高性能和高可靠性的同时,具备形状可弯曲、可伸缩等柔性性能. 本文综述了近年来无机柔性电子器件的进展,包括力学设计原理、基于界面黏附的转印集成方法以及柔性大变形下的失效机理等,并展望了未来的应用和发展.

English Abstract

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