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AlGaN/GaN heterojunction epitaxies with wide bandgap, high critical electric field as well as high density and high mobility two-dimensional electron gas have shown great potential applications in the next-generation high-power and high-frequency devices. Especially, with the development of Si-based GaN epitaxial technique with big size, GaN devices with low cost also show great advantage in consumer electronics. In order to improve the rectification efficiency of AlGaN/GaN Schottky barrier diode (SBD), low leakage current and low turn-on voltage are important. The GaN Schottky barrier diode with low work-function metal as anode is found to be very effective to reduce turn-on voltage. However, the low Schottky barrier height makes the Schottky interface sensitive to damage to groove surface, which leads to a high leakage current. In this work, a novel wet-etching technique with thermal oxygen oxidation and KOH corrosion is used to prepare the anode groove, and the surface roughness of groove decreases from 0.57 to 0.23 nm, compared with that of the dry-etching surface of groove. Meanwhile, the leakage current is suppressed from 1.5 × 10–6 to 2.6 × 10–7 A/mm. Benefiting from the great corrosion selectively of hot KOH solution to AlGaN barrier layer and GaN channel layer after thermal oxygen oxidation, the spikes of the edge of groove region caused by the nonuniform distribution of plasma in the cavity is improved, and the breakdown voltage of the fabricated AlGaN/GaN SBDs is raised from –1.28 to –1.73 kV.
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Keywords:
- AlGaN/GaN /
- Schottky barrier diode /
- low leakage current /
- high breakdown voltage
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图 1 凹槽阳极结构低功函数阳极金属AlGaN/GaN SBD器件截面图
Figure 1. Cross-sectional schematic view of AlGaN/GaN SBD with groove anode and low work-function metal as anode.
图 2 (a)湿法腐蚀和(b)干法刻蚀阳极凹槽深度及凹槽底部表面形貌
Figure 2. Depth of groove anode and roughness of the bottom surface fabricated by (a) wet etching and (b) dry etching.
图 3 基于湿法腐蚀凹槽制备技术的AlGaN/GaN SBD阳极凹槽边缘的(a)透射电子显微镜切面图和(b)EDS元素分析
Figure 3. (a) Transmission electron microscopy and (b) EDX analysis around the anode edge of the AlGaN/GaN SBD fabricated by wet-etching technique.
图 4 (a)湿法腐蚀和(b)干法刻蚀阳极凹槽表面F 1s核级谱
Figure 4. F 1s core-level spectra of the bottom surface fabricated by (a) wet etching and (b) dry etching.
图 5 线性坐标下器件正向导通特性
Figure 5. Forward I-V characteristics of the fabricated AlGaN/GaN SBDs in linear-scale.
图 6 半对数坐标下器件反向击穿特性
Figure 6. Reverse I-V curves of the fabricated AlGaN/GaN SBDs in semi-log scale.
图 7 湿法腐蚀凹槽表面Ga 3d核级谱
Figure 7. Ga 3d core-level spectra of the bottom surface fabricated by wet etching.
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[1] Otake H, Chikamatsu K, Yamaguchi A, Fujishima T, Ohta H 2008 Appl. Phys. Express 1 011105
Google Scholar
[2] Guo Z B, Hitchcock C, Wetzel C, Karlicek R F, Jr, Piao G X, Yano Y, Koseki S, Tabuchi T, Matsumoto K, Bulsara M, Chow T P 2019 IEEE Electr. Device L. 40 1736
Google Scholar
[3] Liu L, Wang J, Wang H Y, Ren N, Guo Q, Sheng K 2022 IEEE Electr. Device L. 43 104
Google Scholar
[4] 陈睿, 梁亚楠, 韩建伟, 王璇, 杨涵, 陈钱, 袁润杰, 马英起, 上官士鹏 2021 物理学报 70 116102
Rui C, Liang Y N, Han J W, Wang X, Yang H, Chen Q, Yuan R J, Ma Y Q, Shangguan S P 2021 Acta Phys. Sin. 70 116102
[5] Hu J, Stoffels S, Zhao M, Tallarico A N, Rossetto I, Meneghini M, Kang X W, Bakeroot B, Marcon D, Kaczer B, Decoutere S, Groeseneken G 2017 IEEE Electron Dev. Lett. 38 371
Google Scholar
[6] Xu W Z, Zhou F, Liu Q, Ren F F, Zhou D, Chen D J, Zhang R, Zheng Y D, Lu H 2021 IEEE Electron Dev. Lett. 42 1743
Google Scholar
[7] Li X D, Geens K, Guo W M, You S Z, Zhao M, Fahle D, Odnoblyudov V, Groeseneken G, Decoutere S 2019 IEEE Electron Dev. Lett. 40 1499
Google Scholar
[8] Nela L, Kampitsis G, Ma J, Matioli E 2020 IEEE Electron Dev. Lett. 41 99
Google Scholar
[9] Zhu M D, Song B, Qi M, Hu Z Y, Nomoto K, Yan X D, Cao Y, Johnson W, Kohn E, Jena D, Xing H L G 2015 IEEE Electron Dev. Lett. 36 375
Google Scholar
[10] Liu C, Khadar R A, Matioli E 2018 IEEE Electron Dev. Lett. 39 71
Google Scholar
[11] Zhang Y H, Sun M, Wong H Y, Lin Y X, Srivastava P, Hatem C, Azize M, Piedra D, Yu L L, Sumitomo T, Braga N D A, Mickevicius R V, Palacios T 2015 IEEE Trans. Electron Dev. 62 2155
Google Scholar
[12] Zhang T, Zhang J C, Zhou H, Wang Y, Chen T S, Zhang K, Zhang Y C, Dang K, Bian Z K, Zhang J F, Xu S R, Duan X L, Ning J, Hao Y 2019 IEEE Electron Dev. Lett. 40 1583
Google Scholar
[13] Zhang T, Wang Y, Zhang Y N, Lv Y G, Ning J, Zhang Y C, Zhou H, Duan X L, Zhang J C, Hao Y 2021 IEEE Trans. Electron Dev. 68 2661
Google Scholar
[14] 武鹏, 张涛, 张进成, 郝跃 2022 物理学报 158503
Wu P, Zhang T, Zhang J C, Hao Y 2022 Acta Phys. Sin. 158503
[15] Tsou C W, Wei K P, Lian Y W, Hsu S S H 2016 IEEE Electron Dev. Lett. 37 70
Google Scholar
[16] Xu R, Chen P, Liu M H, Zhou J, Li Y M, Cheng K, Liu B, Chen D J, Xie Z L, Zhang R, Zheng Y D 2021 IEEE Electron Dev. Lett. 42 208
Google Scholar
[17] Zhou Q, Jin Y, Shi Y Y, Mou J Y, Bao X, Chen B W, Zhang B 2015 IEEE Electron Dev. Lett. 36 660
Google Scholar
[18] Gao J N, Wang M J, Yin R Y, Liu S F, Wen C P, Wang J Y, Wu W G, Hao Y L, Jin Y F, Shen B 2017 IEEE Electron Dev. Lett. 38 1425
Google Scholar
[19] Hu J, Stoffels S, Lenci S, Bakeroot B, Jaeger B D, Hove M V, Ronchi N, Venegas R, Liang H, Zhao M, Groeseneken G, Decoutere S 2016 IEEE Trans. Electron Dev. 63 997
Google Scholar
[20] Lei J C, Wei J, Tang G F, Zhang Z F, Qian Q K, Zheng Z Y, Hua M Y, Chen K J 2018 IEEE Electron Dev. Lett. 39 260
Google Scholar
[21] Ma J, Matioli E 2017 IEEE Electron Dev. Lett. 38 83
Google Scholar
[22] Ma J, Matioli E 2018 Appl. Phys. Lett. 112 052101
Google Scholar
[23] Xu Z, Wang J Y, Liu Y, Cai J B, Liu J Q, Wang M J, Yu M, Xie B, Wu W G, Ma X H, Zhang J C 2013 IEEE Electron Dev. Lett. 34 7
[24] Wang Y, Wang M J, Xie B, Wen C P, Wang J Y, Hao Y L, Wu W G, Chen K J, Shen B 2013 IEEE Electron Dev. Lett. 34 11
[25] Xu Z, Wang J Y, Liu J Q, Jin C Y, Cai Y, Yang Z C, Wang M J, Yu M, Xie B, Wu W G, Ma X H, Zhang J C, Hao Y 2014 IEEE Electron Dev. Lett. 35 12
Google Scholar
[26] Carin R, Deville J P, Werckmann J 1990 Sur. Interface Anal. 16 65
Google Scholar
[27] Bian Z K, Zhang J C, Zhao S L, Zhang Y C, Duan X L, Chen J B, Ning J, Hao Y 2020 IEEE Electron Dev. Lett. 41 10
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