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本文以原子层沉积超薄氧化铝(Al2 O3)为过渡层, 采用射频反应磁控溅射法在硅半导体基片上制备了颗粒致密并具有(011)择优取向的二氧化钒(VO2)薄膜. 该薄膜具有显著的绝缘体金属相变特性, 相变电阻变化超过3 个数量级, 热滞回线宽度约为6℃. 基于VO2薄膜构建了平面二端器件并测试了不同温度下I-V曲线, 观测到超过2个数量级的电流跃迁幅度, 显示了优越的电致相变特性. 室温下电致相变阈值电压为8.6 V, 电致相变弛豫电压宽度约0.1 V. 随着温度升高到60℃, 其电致相变所需要的阈值电压减小到2.7 V. 本实验制备的VO2薄膜在光电存储、开关、太赫兹调控器件中具有广泛的应用价值.Quality enhanced VO2 thin films have been sputtering deposited on silicon substrates by introducing an ultrathin Al2 O3 buffer between the substrate and the film. With a preferred orientation (011), the VO2 films have an excellent thermal-induced metal-insulator transition (MIT). The electrically-driven MIT (E-MIT) characteristics have also been investigated by applying voltage to VO2 thin film based two-terminal device at particular temperatures. Sharp jumps in electric current are observed in the I-V curve with a variation of amplitude by two orders. The threshold voltage decreases with increasing temperature. At room tempature, the threshold voltage is 8.6V and the phase transition ccurs in a voltage width of only 0.1V. With the sharp and fast phase change, the VO2 thin films can be used in ultrafast switching electronic devices.
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Keywords:
- vanadium dioxide /
- electrically-driven metal-insulator transition /
- silicon substrate /
- aluminium oxide
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[12] Okimura K, Sakai J, Ramanathan S 2010 Journal of Applied Physics 107 063503
[13] Wu T L, Whittaker L, Banerjee S, and Sambandamurthy G 2011 Phys. Rev. B 83 073101
[14] Seo G, Kim B J, Ko C, Cui Y, Lee Y W, Shin J H, Ramanathan S, Kim H T 2011 IEEE Electron Device Lett. 32 1582
[15] Mo M M, Wen Q Y, Chen Z, Yang Q H, Qiu D H, Li S, Jing Y L, Zhang H W 2014 Chin. Phys. B 23 047803
[16] Wen Q Y, Zhang H W, Yang Q H, Xie Y S, Chen K, Liu Y L 2010 Appl. Phys. Lett. 97 021111
[17] Stefanovich G, Pergament A, Stefanovich D 2000 J. Phys.: Condens. Matter 12 8837
[18] Zhou Y, Chen X N, Ko Changhyun, Yang Z, Mouli C, Ramanathan S 2013 IEEE Electron Device Lett. 34 220
[19] Tu K N, Ziegler J F, Kircher C J 1973 Appl. Phys. Lett. 23 493
[20] Yuan N Y, Li J H, Li G, Chen X S 2006 Thin Solid Films 515 1275
[21] Wang L X, Li J P, He X L, Gao X G 2006 Acta Phys. Sin. 55 6 (in Chinese) [王利霞, 李建平, 何秀丽, 高晓光2006物理学报55 6]
[22] Qiu D H, Wen Q Y, Yang Q H, Chen Z, Jing Y L, Zhang H W 2013 Acta Phys. Sin. 62 217201 (in Chinese) [邱东鸿, 文岐业, 杨青慧, 陈智,荆玉兰, 张怀武 2013 物理学报 62 217201]
[23] Fabien Béteille, Léo Mazerolles 1999 Materials Research Bulletin 34 2121
[24] Borek M, Qian F, N agabushnam V, Singh R K 1993 Appl. Phys. Lett. 63 3288
[25] Zhao Y, Lee J H, Zhu Y H, Nazari M, Chen C H, Wang H Y, Bernussi A, Holtz M, Fan Z Y 2012 J. Appl. Phys. 111 053533
[26] Crunteanu A, Givernaud J, Leroy J, Mardivirin D, Champeaux C, OrliangesJ C, Catherinot A, Blondy P 2010 Sci. Technol. Adv. Mater. 11 065002
[27] Dumas-Bouchiat F, Champeaux C, Catherinot A, Crunteanu A, Blondy P 2007 Appl. Phys. Lett. 91 223505
[28] Chae B G, Kim H T, Youn D H, Kang K Y 2005 Physica B-Condensed Matter 369 1
[29] Kim H T, Chae B G, Youn D H, Maeng S L, Kim G, Kang K Y, Lim Y S 2004 New J. Phys. 6 52
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[1] Morin F J 1959 Phys. Rev. Lett. 3 34
[2] Lysenko S, Rua A J, Vikhnin V, Jimenez J, Fernandez F, Liu H 2006 Appl. Surf. Sci. 252 5512
[3] Guzman G, Beteille F, Morineau R, Livage J 1996 J. Mater. Chem. 6 505
[4] Ko C and Ramanathan S 2008 Appl. Phys. Lett. 93 252101
[5] Cao J, Ertekin E, Srinivasan V, Fan W, Huang S, Zheng H, Yim J W L, Khanal D R, Ogletree D F, Grossman J C, Wu J 2009 Nat. Nanotechnol. 4 732
[6] Zhao Y, Lee J H, Zhu Y H, Nazari M, Chen C H, Wang H Y, BernussiA, Holtz M, Fan Z Y 2012 J. Appl. Phys. 111 0535339
[7] Ruzmetov D, Zawilski K T, Narayanamurti V, and Ramanathana S 2007 Journal of Appl. Phys. 102 13715
[8] Kucharczy k D, Niklew ski T 1979 J. Appl. Cryst. 12 370
[9] Zylbersztejn A Mott N F 1975 Phys. Rev. B 11 4383
[10] Kanki T, Hotta Y, Asakawa N, Kawai T, Tanaka H 2010 Appl. Phys. Lett. 96 242108
[11] Jeong J, Aetukuri N, Graf T, Schladt T D, Samant M G, Parkin, SSP 2013 Science 339 6126
[12] Okimura K, Sakai J, Ramanathan S 2010 Journal of Applied Physics 107 063503
[13] Wu T L, Whittaker L, Banerjee S, and Sambandamurthy G 2011 Phys. Rev. B 83 073101
[14] Seo G, Kim B J, Ko C, Cui Y, Lee Y W, Shin J H, Ramanathan S, Kim H T 2011 IEEE Electron Device Lett. 32 1582
[15] Mo M M, Wen Q Y, Chen Z, Yang Q H, Qiu D H, Li S, Jing Y L, Zhang H W 2014 Chin. Phys. B 23 047803
[16] Wen Q Y, Zhang H W, Yang Q H, Xie Y S, Chen K, Liu Y L 2010 Appl. Phys. Lett. 97 021111
[17] Stefanovich G, Pergament A, Stefanovich D 2000 J. Phys.: Condens. Matter 12 8837
[18] Zhou Y, Chen X N, Ko Changhyun, Yang Z, Mouli C, Ramanathan S 2013 IEEE Electron Device Lett. 34 220
[19] Tu K N, Ziegler J F, Kircher C J 1973 Appl. Phys. Lett. 23 493
[20] Yuan N Y, Li J H, Li G, Chen X S 2006 Thin Solid Films 515 1275
[21] Wang L X, Li J P, He X L, Gao X G 2006 Acta Phys. Sin. 55 6 (in Chinese) [王利霞, 李建平, 何秀丽, 高晓光2006物理学报55 6]
[22] Qiu D H, Wen Q Y, Yang Q H, Chen Z, Jing Y L, Zhang H W 2013 Acta Phys. Sin. 62 217201 (in Chinese) [邱东鸿, 文岐业, 杨青慧, 陈智,荆玉兰, 张怀武 2013 物理学报 62 217201]
[23] Fabien Béteille, Léo Mazerolles 1999 Materials Research Bulletin 34 2121
[24] Borek M, Qian F, N agabushnam V, Singh R K 1993 Appl. Phys. Lett. 63 3288
[25] Zhao Y, Lee J H, Zhu Y H, Nazari M, Chen C H, Wang H Y, Bernussi A, Holtz M, Fan Z Y 2012 J. Appl. Phys. 111 053533
[26] Crunteanu A, Givernaud J, Leroy J, Mardivirin D, Champeaux C, OrliangesJ C, Catherinot A, Blondy P 2010 Sci. Technol. Adv. Mater. 11 065002
[27] Dumas-Bouchiat F, Champeaux C, Catherinot A, Crunteanu A, Blondy P 2007 Appl. Phys. Lett. 91 223505
[28] Chae B G, Kim H T, Youn D H, Kang K Y 2005 Physica B-Condensed Matter 369 1
[29] Kim H T, Chae B G, Youn D H, Maeng S L, Kim G, Kang K Y, Lim Y S 2004 New J. Phys. 6 52
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