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基于MAPbI3/Graphene/Si复合结构的高灵敏宽带太赫兹调制器

赖伟恩 邬宗冬 李力奇 刘根 方彦俊

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基于MAPbI3/Graphene/Si复合结构的高灵敏宽带太赫兹调制器

赖伟恩, 邬宗冬, 李力奇, 刘根, 方彦俊

Highly sensitive broadband terahertz modulator based on MAPbI3/Graphene/Si composite structure

Lai Wei-En, Wu Zong-Dong, Li Li-Qi, Liu Gen, Fang Yan-Jun
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  • 高性能硅基太赫兹调制器是构建超宽带太赫兹-光纤混合通信系统的关键器件之一. 提出了一种基于钙钛矿/石墨烯/硅(MAPbI3/Graphene/Si)复合结构的近红外光驱动的超宽带大调制深度太赫兹调制器. 实验结果表明, 石墨烯薄膜和钙钛矿空穴传输层在近红外光驱动下可有效地促进界面电荷分离, 增大载流子复合寿命, 显著增强器件的表面电导率, 进一步调控太赫兹波的传输幅度, 实现光控型太赫兹波调制器的功能. 通过波长808 nm的近红外调制激励源, 对器件在0.2—2.5 THz超宽频率范围的太赫兹透射特性进行表征, 实验用6.1 mW/mm2的低功率密度近红外光驱动下实现了高达88.3%的大调制深度, 远高于裸硅基底的调制深度(约14.0%), 具有高灵敏、宽带和大调制深度等显著优势, 并且建立了相应的半解析器件模型, 仿真验证了实验结果. 所提出的MAPbI3/Graphene复合薄膜在增强硅基调制器性能方面效果显著, 为未来实现硅基太赫兹调制器在近红外太赫兹-光纤混合通信系统的集成提供了一种新策略.
    A high-performance silicon-based terahertz modulator is one of the key devices for building an ultrawideband terahertz-fiber hybrid communication system. In this paper, an ultrawideband terahertz modulator with large modulation depth based on a chalcogenide/graphene/silicon (MAPbI3/Graphene/Si) composite structure driven by near-infrared light (NIR) is proposed. The experimental results show that the graphene thin film and the chalcogenide hole transport layer can effectively promote the interfacial charge separation, increase the carrier complex lifetime, significantly enhance the surface conductivity of the device, further modulate the terahertz wave transmission amplitude, and realize the function of the light-controlled terahertz wave modulator under the NIR light drive. The terahertz transmission characteristics of the device are characterized by an 808 nm NIR modulation excitation source, and a large modulation depth of up to 88.3% is achieved in an ultra-wide frequency range of 0.2–2.5 THz and a low power density of 6.1 mW/mm2 driven by NIR light, which is much higher than that of the bare silicon substrate (14.0%), with the significant advantages of high sensitivity, broadband, and large modulation depth. The corresponding semi-analytical device model is established and the experimental results are verified by simulation. The proposed MAPbI3/Graphene composite thin film is effective in enhancing the silicon-based modulator performance and provides a new strategy for the future integration of silicon-based terahertz modulators in NIR terahertz-fiber hybrid communication systems.
      通信作者: 赖伟恩, wnlai@hfut.edu.cn ; 方彦俊, jkfang@zju.edu.cn
    • 基金项目: 安徽省高校协同创新项目(批准号: GXXT-2022-015)和国家自然科学基金(批准号: 61905058)资助的课题.
      Corresponding author: Lai Wei-En, wnlai@hfut.edu.cn ; Fang Yan-Jun, jkfang@zju.edu.cn
    • Funds: Project supported by the University Synergy Innovation Program of Anhui Province, China (Grant No. GXXT-2022-015) and the National Natural Science Foundation of China (Grant No. 61905058).
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  • 图 1  (a) MAPbI3/Graphene基调制器结构示意图, 左侧为三维示意图, 右侧为侧视图; (b)硅基底上MAPbI3/Graphene复合薄膜的SEM表征图, 左侧为俯视图, 右侧为侧视图; (c) MAPbI3薄膜在波长500—800 nm下的吸收光谱

    Fig. 1.  (a) Schematic diagram of MAPbI3/Graphene-based modulator structure; left, 3D schematic; right, side view; (b) SEM characterization of MAPbI3/Graphene composite thin film on silicon substrate; left, top view; right, side view; (c) absorption spectrum of MAPbI3 thin film at the wavelength range of 500–800 nm.

    图 2  (a) MAPbI3/Graphene模型光照示意图; (b) MAPbI3/Graphene复合薄膜加光激励后的能带示意图以及电子-空穴的流动情况

    Fig. 2.  (a) Schematic of MAPbI3/Graphene model with light; (b) schematic diagram of energy band of MAPbI3/Graphene composite thin film after adding light excitation and electron-hole flow condition.

    图 3  (a) Graphene/Si调制器和(b) MAPbI3/Graphene/Si调制器的I-V曲线测试示意图; (c) Graphene/Si调制器和(d) MAPbI3/Graphene/Si调制器在光照(红线)和无光照(蓝线)下的I-V测试曲线; (e) Graphene/Si调制器和(f) MAPbI3/Graphene/Si调制器在0.5 V偏压, 15.1 mW功率光激励下的开关响应曲线

    Fig. 3.  Schematic diagram of I-V curve test for (a) Graphene/Si modulator and (b) MAPbI3/Graphene/Si modulator; I-V test curves for (c) Graphene/Si modulator and (d) MAPbI3/Graphene/Si modulator under light (red line) and no light (blue line); switching response curves of (e) Graphene/Si modulator and (f) MAPbI3/Graphene/Si modulator under light excitation with 0.5 V bias and 15.1 mW power.

    图 4  在不同功率密度的激光照射下通过(a)裸硅和(b) MAPbI3/Graphene/Si传输的太赫兹脉冲时域波形; 在不同功率密度的激光照射下通过(c)裸硅和(d) MAPbI3/Graphene/Si传输的太赫兹脉冲的归一化透射; 在不同功率密度的激光照射下(e) 裸硅和(f) MAPbI3/Graphene/Si的太赫兹调制深度

    Fig. 4.  Time domain waveforms of terahertz pulses transmitted through (a) bare silicon and (b) MAPbI3/Graphene/Si under laser irradiation at different power density; normalized transmission of terahertz pulses transmitted through (c) bare silicon and (d) MAPbI3/Graphene/Si under laser irradiation at different power density; terahertz modulation depth of (e) bare silicon and (f) MAPbI3/Graphene/Si under laser irradiation at different power density.

    图 5  (a) MAPbI3/Graphene/Si复合结构的响应时间测试示意图; (b) 器件的响应时间函数

    Fig. 5.  (a) Schematic diagram of response time testing of MAPbI3/Graphene/Si composite structure; (b) response time function of device.

    图 6  (a) 仿真模拟模型示意图; (b) 通过改变模型的电导率来调制太赫兹脉冲的波形

    Fig. 6.  (a) Schematic diagram of the simulated model; (b) waveform of modulated terahertz pulse by changing conductivity of model.

    表 1  常见太赫兹调制器性能比较

    Table 1.  Performance comparison of common terahertz modulators.

    MaterialWavelength/nmPower density/(mW·mm–2)Spectral range/THzMD/%Reference
    MAPbI3/Graphene/Si8086.10.2—2.588.3This work
    MAPbI3/SiO2106453.10.1—1.066.2[33]
    MoS2/Si5322.40.2—2.075.0[34]
    Graphene/TiO2/Si80871.30.3—1.788.0[35]
    Silicon nanotip80860.00.1—4.091.6[36]
    MAPbBr3/Si45030.00.2—2.680.0[37]
    CsPbBr3/Si45020.00.23—0.3545.5[38]
    Graphene/Si780159.20.2—2.099.0[29]
    下载: 导出CSV
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出版历程
  • 收稿日期:  2023-04-04
  • 修回日期:  2023-05-17
  • 上网日期:  2023-06-02
  • 刊出日期:  2023-08-05

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