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Ultrashort pulse laser heating is not only capable of resolving and observing the ultrafast interaction of energy carriers, i.e. electrons, phonons, but also widely applied to material processing, i.e., laser ablation. However, the previous theories, i.e., two-temperature model, parabolic one-step model, can be applied only to some limited segments. In this paper, according to the two-temperature model and Fourier’s law, a general theoretical model is presented for the description of the entire heat relaxation process after the thin metal film deposited on the substrate has been heated by the ultrashort pulse laser. Moreover, the heat conduction process is also experimentally studied by using the rear-pump front-probe transient thermoreflectance technique on Au/glass and Au/SiC at 300 K, and the theoretical prediction accords well with the experimental result, which illustrates the validity of the present theoretical model. Based on the good agreement between theoretical predictions and experimental data, the electron-phonon coupling factor of the thin gold film and thermal boundary conductance of the Au/glass and Au/SiC interfaces are extracted and the measured results are in good agrement with the previous reported values. The electron-phonon coupling factor is close to that of the bulk material and does not exhibit size effect. The thermal boundary conductance is greater than the prediction of diffuse mismatch model, and the reasons responsible for the discrepancies are electrons participating in the interfacial heat conduction, interfacial atom diffusion and inelastic scattering.
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Keywords:
- femtosecond pulse laser /
- electron-phonon coupling /
- thermal boundary conductance /
- transient thermoreflectance
[1] Chen J K, Latham W P, Beraun J E 2005 J. Laser Appl. 17 63
[2] Xia Z L, Fan Z X, Shao J D 2006 Acta Phys. Sin. 55 3007 (in Chinese)[夏志林、范正修、邵建达 2006 物理学报 55 3007]
[3] Kaganov M I, Lifshitz I M, Tanatarov L V 1957 Sov. Phys. JETP 4 173
[4] Anisimov S, Kapeliovich B, Perelman T 1974 Sov. Phys. JETP 39 375
[5] Qiu T Q, Tien C L 1993 J. Heat Transf. Trans. ASME 115 835
[6] Eesley G L 1983 Phys. Rev. Lett. 51 2140
[7] Xiong G C, Zou Y H, Xia Z J, Yuan P, Lian G J, Li J 1994 Acta Phys. Sin. 43 1860 (in Chinese)[熊光成、邹英华、夏宗炬、袁 平、连贵君、李 洁 1994 物理学报 43 1860]
[8] Norris P M, Caffrey A P, Stevens R J, Klopf J M, McLeskey J T, Smith A N 2003 Rev. Sci. Instrum. 74 400
[9] Cahill D G 2004 Rev. Sci. Instrum. 75 5119
[10] Costescu R M, Wall M A, Cahill D G 2003 Phys. Rev. B 67 054302
[11] Schmidt A J, Chen X Y, Chen G 2008 Rev. Sci. Instrum. 79 114902
[12] Wang H D, Ma W G, Zhang X, Wang W 2010 Acta Phys. Sin. 59 3856 (in Chinese) [王海东、马维刚、张 兴、王玮 2010 物理学报 59 3856]
[13] Kittel C 2005 Introduction to Solid State Physics (8th Ed.) (New York: Wiley) p141
[14] Qiu T Q, Tien C L 1994 Int. J. Heat Mass Transf. 37 2789
[15] Majumdar A, Reddy P 2004 Appl. Phys. Lett. 84 4768
[16] Zhang H X, Guo H, Chen Z, Zhang G B, Li Z H 2007 J. Micromech. Microeng. 17 775
[17] Hohlfeld J, Wellershoff S S, Güdde J, Conrad U, Jhnke V, Matthias E 2000 Chem. Phys. 251 237
[18] Norris P M, Hopkins P E 2009 J. Heat Transf.Trans. ASME 131 043207
[19] Swartz E T, Pohl R O 1989 Rev. Mod. Phys. 61 605
[20] Hopkins P E, Norris P M, Stevens R J, Beechem T E, Graham S 2008 J. Heat Transf.Trans. ASME 130 062402
[21] Jagannadham K, Wang Hsin 2002 J. Appl. Phys. 91 1224
[22] Chen G 1998 Phys. Rev. B 57 14958
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[1] Chen J K, Latham W P, Beraun J E 2005 J. Laser Appl. 17 63
[2] Xia Z L, Fan Z X, Shao J D 2006 Acta Phys. Sin. 55 3007 (in Chinese)[夏志林、范正修、邵建达 2006 物理学报 55 3007]
[3] Kaganov M I, Lifshitz I M, Tanatarov L V 1957 Sov. Phys. JETP 4 173
[4] Anisimov S, Kapeliovich B, Perelman T 1974 Sov. Phys. JETP 39 375
[5] Qiu T Q, Tien C L 1993 J. Heat Transf. Trans. ASME 115 835
[6] Eesley G L 1983 Phys. Rev. Lett. 51 2140
[7] Xiong G C, Zou Y H, Xia Z J, Yuan P, Lian G J, Li J 1994 Acta Phys. Sin. 43 1860 (in Chinese)[熊光成、邹英华、夏宗炬、袁 平、连贵君、李 洁 1994 物理学报 43 1860]
[8] Norris P M, Caffrey A P, Stevens R J, Klopf J M, McLeskey J T, Smith A N 2003 Rev. Sci. Instrum. 74 400
[9] Cahill D G 2004 Rev. Sci. Instrum. 75 5119
[10] Costescu R M, Wall M A, Cahill D G 2003 Phys. Rev. B 67 054302
[11] Schmidt A J, Chen X Y, Chen G 2008 Rev. Sci. Instrum. 79 114902
[12] Wang H D, Ma W G, Zhang X, Wang W 2010 Acta Phys. Sin. 59 3856 (in Chinese) [王海东、马维刚、张 兴、王玮 2010 物理学报 59 3856]
[13] Kittel C 2005 Introduction to Solid State Physics (8th Ed.) (New York: Wiley) p141
[14] Qiu T Q, Tien C L 1994 Int. J. Heat Mass Transf. 37 2789
[15] Majumdar A, Reddy P 2004 Appl. Phys. Lett. 84 4768
[16] Zhang H X, Guo H, Chen Z, Zhang G B, Li Z H 2007 J. Micromech. Microeng. 17 775
[17] Hohlfeld J, Wellershoff S S, Güdde J, Conrad U, Jhnke V, Matthias E 2000 Chem. Phys. 251 237
[18] Norris P M, Hopkins P E 2009 J. Heat Transf.Trans. ASME 131 043207
[19] Swartz E T, Pohl R O 1989 Rev. Mod. Phys. 61 605
[20] Hopkins P E, Norris P M, Stevens R J, Beechem T E, Graham S 2008 J. Heat Transf.Trans. ASME 130 062402
[21] Jagannadham K, Wang Hsin 2002 J. Appl. Phys. 91 1224
[22] Chen G 1998 Phys. Rev. B 57 14958
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