Optimizing microstructure and mechanical properties of CoCrFeNi high-entropy alloy microfibers by electric current treatment

BO Le; GAO Xiaoyu; NING Zhiliang; WANG Li; SUN Jianfei; ZHANG Zhenjiang; HUANG Yongjiang

doi:10.7498/aps.74.20250518

Abstract

High-entropy alloy (HEA) microfibers exhibit promising prospects in microscale high-tech applications due to their exceptional mechanical properties and stability. However, the strength-plasticity tradeoff largely hinders their further industrial applications. Heat treatment can optimize the mechanical properties of HEA microfibers. However, the traditional heat treatment (CHT) faces challenges in accurately adjusting the microstructures in a short period of time, while also being prone to grain coarsening, which can affect performance. In this study, an electric current treatment (ECT) technique is used to finely modulate the properties of cold-drawn CoCrFeNi high-entropy alloy microfibers on a microscale (~70 μm in diameter), the effects of thermal and athermal effects during ECT on microstructure and mechanical properties are systematically investigated through electron back scatter diffraction, transmission electron microscopy, and synchrotron radiation. A model of recrystallization, nucleation and growth of HEA microfibers is established. Compared with CHT, the synergistic effects of electron wind force and Joule heating during ECT significantly accelerate recrystallization kinetics, yielding finer and more homogeneous grains with a great decrease in dislocation density, and finally lead to better mechanical properties. The ECT-processed HEA microfibers achieve a yield strength in a range from 400 to 2033 MPa and a tensile elongation reaching 53%, which are much higher than those of CHT samples. These results demonstrate that the ECT is effective for optimizing the microstructure and properties of HEA microfibers, and can also provide both a theoretical foundation and technical guidance for fabricating high-performance metallic microfibers.

Keywords:

Authors and contacts

1.
School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
2.
Chang’an Wangjiang Industrial Co., Ltd., Chongqing 401120, China
3.
School of Aeronautics and Astronautics, Chongqing University, Chongqing 400044, China
4.
Physics Group, Bazhou No.1 High School, Bazhou 065700, China

Corresponding author: ZHANG Zhenjiang, river18202@163.com ; HUANG Yongjiang, yjhuang@hit.edu.cn

Funds: Project supported by the National Natural Science Foundation of China (Grant No. 52371106).

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References

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Cited By

图 1 不同电流密度电流处理CoCrFeNi高熵合金纤维的IPF图和KAM图　(a), (a1) ECT120; (b), (b1) ECT140; (c), (c1) ECT160; (d), (d1) ECT180; (e), (e1) ECT200

Figure 1. IPF and KAM images of electric current treated CoCrFeNi HEA microfibers with various current densities: (a), (a1) ECT120; (b), (b1) ECT140; (c), (c1) ECT160; (d), (d1) ECT180; (e), (e1) ECT200.

DownLoad: Full-Size Img PowerPoint

图 2 不同热效应温度处理高熵合金纤维的IPF图和KAM图　(a), (a1) CHT747; (b), (b1) CHT850; (c), (c1) CHT943; (d), (d1) CHT1013; (e), (e1) CHT1075

Figure 2. IPF and KAM images of HEA microfibers with different thermal effect temperatures: (a), (a1) CHT747; (b), (b1) CHT850; (c), (c1) CHT943; (d), (d1) CHT1013; (e), (e1) CHT1075.

DownLoad: Full-Size Img PowerPoint

图 3 (a), (b) ECT和CHT处理的高熵合金纤维的高能X射线衍射图谱; (c) 高能X射线衍射图谱中得到的相应位错密度

Figure 3. High energy X-ray diffraction (HEXRD) patterns of the microfibers processed under different (a) ECT and (b) CHT conditions; (c) corresponding dislocation density from the HEXRD patterns.

DownLoad: Full-Size Img PowerPoint

图 4 不同处理方式得到的CoCrFeNi纤维的工程应力应变曲线　(a)不同电流密度电流处理; (b)不同温度退火处理

Figure 4. Engineering tensile stress-strain curves of CoCrFeNi microfibers treated with different methods: (a) Different current densities for ECT; (b) different temperatures for CHT.

DownLoad: Full-Size Img PowerPoint

图 5 (a), (b) ECT100纤维的TEM明场像; (c), (d) CHT623纤维的TEM明场像及对应的选区电子衍射斑点

Figure 5. (a), (b) TEM bright field images of ECT100 microfibers; (c), (d) TEM bright field images and corresponding selected area electron diffraction pattern of CHT623 microfibers.

DownLoad: Full-Size Img PowerPoint

图 6 (a), (b) ECT120纤维的TEM明场图像; (c), (d) CHT747纤维的TEM明场图像

Figure 6. (a), (b) TEM bright field images of ECT120 microfibers; (c), (d) TEM bright field images of CHT747 microfibers.

DownLoad: Full-Size Img PowerPoint

图 7 电流处理对CoCrFeNi高熵合金纤维再结晶的作用机制示意图　(a)冷拔态; (b)再结晶形核(位错重排); (c)部分再结晶; (d)完全再结晶

Figure 7. Schematic diagram of the mechanism of electric current treatment on CoCrFeNi HEA microfiber recrystallization: (a) Cold drawn; (b) recrystallized nucleation (dislocation rearrangement); (c) partial recrystallization; (d) complete recrystallization.

DownLoad: Full-Size Img PowerPoint

表 1 实验设计方案

Table 1. Experimental design scheme.

电流密度 /(A·mm^–2)	标记	稳定温度/K	传统热处理温度/K	标记
100	ECT100	623	623	CHT623
120	ECT120	747	747	CHT747
140	ECT140	850	850	CHT850
160	ECT160	943	943	CHT943
180	ECT180	1013	1013	CHT1013
200	ECT200	1075	1075	CHT1075

DownLoad: CSV

表 2 电流处理和热处理样品的平均晶粒尺寸

Table 2. Average grain size of samples subjected to ECT and CHT.

样品	晶粒尺寸/μm	样品	晶粒尺寸/μm
ECT100	—	CHT623	—
ECT120	1.5±0.2	CHT747	1.3±0.1
ECT140	1.9±0.2	CHT850	1.7±0.2
ECT160	2.5±0.7	CHT943	3.1±0.6
ECT180	4.6±1.1	CHT1013	5.8±1.3
ECT200	15.0±3.1	CHT1075	16.8±4.0

DownLoad: CSV

表 3 不同电流处理和退火处理工艺得到的高熵合金纤维的屈服强度和均匀延伸率

Table 3. Yield strength and uniform elongation of electric current treated microfibers with various current densities and heat treated microfibers with various temperatures.

样品	屈服强度/ MPa	均匀延伸率/ %	样品	屈服强度/ MPa	均匀延伸率/ %
As drawn	1930	0	—	—	—
ECT100	2033	0	CHT623	1680	0
ECT120	1480	7	CHT747	1490	0
ECT140	1130	43	CHT850	1050	3
ECT160	800	52	CHT943	715	13.5
ECT180	550	39	CHT1013	500	41
ECT200	400	19	CHT1075	360	28

DownLoad: CSV

[1]	陈金玺, 徐彬, 戴兰宏, 陈艳 2024 科学通报 69 3154 Google Scholar Chen J X, Xu B, Dai L H, Chen Y 2024 Chin. Sci. Bull. 69 3154 Google Scholar
[2]	高裕昆, 赵洁, 周晶晶, 周静 2025 物理学报 74 057701 Google Scholar Gao Y K, Zhao J, Zhou J J, Zhou J 2025 Acta Phys. Sinica 74 057701 Google Scholar
[3]	Zhang Y F, Wu K K, Shen S N, Zhang Q Y, Cao W, Liu S 2023 J. Micromech. Microeng. 33 025002 Google Scholar
[4]	You J M, Kim H, Kim J, Kwon D S 2021 IEEE Rob. Autom. Lett. 6 7357 Google Scholar
[5]	Abbas M, Eom H S, Byun J Y, Shin D, Kim S H 2023 J. Cleaner Prod. 418 138044 Google Scholar
[6]	Hsu W L, Tsai C W, Yeh A C, Yeh J W 2024 Nat. Rev. Chem. 8 471 Google Scholar
[7]	Sohrabi M J, Kalhor A, Mirzadeh H, Rodak K, Kim H S 2024 Prog. Mater Sci. 144 101295 Google Scholar
[8]	Tong Y, Chen D, Han B, Wang J, Feng R, Yang T, Zhao C, Zhao Y L, Guo W, Shimizu Y, Liu C T, Liaw P K, Inoue K, Nagai Y, Hu A, Kai J J 2019 Acta Mater. 165 228 Google Scholar
[9]	Wang K Y, Cheng Z J, Liu C Y, Yu H P, Ning Z L, Ramasamy P, Eckert J, Sun J F, Huang Y J, Zhang Y M, Ngan A H W 2025 Int. J. Plast. 189 104321 Google Scholar
[10]	Wang K Y, Cheng Z J, Ning Z L, Yu H P, Ramasamy P, Eckert J, Sun J F, Ngan A H W, Huang Y J 2025 Rare Metals 44 1332 Google Scholar
[11]	Li D Y, Li C X, Feng T, Zhang Y D, Sha G, Lewandowski J J, Liaw P K, Zhang Y 2017 Acta Mater. 123 285 Google Scholar
[12]	Ma X G, Chen J, Wang X H, Xu Y J, Xue Y J 2019 J. Alloys Compd. 795 45 Google Scholar
[13]	Liu J P, Chen J X, Liu T W, Li C, Chen Y, Dai L H 2020 Scr. Mater. 181 19 Google Scholar
[14]	Chen J X, Chen Y, Liu J P, Liu T W, Dai L H 2021 Scr. Mater. 199 113897 Google Scholar
[15]	Gao X Y, Liu J, Fu W J, Huang Y J, Ning Z L, Zhang Z, Sun J F, Chen W 2023 Mater. Des. 233 112250 Google Scholar
[16]	Zhou S C, Dai C D, Hou H X, Lu Y P, Liaw P K, Zhang Y 2023 Scr. Mater 226 115234 Google Scholar
[17]	Deng L, Li R X, Luo J R, Li S L, Xie X F, Wu S S, Zhang W R, Liaw P K, Korznikova E A, Zhang Y 2024 Int. J. Plast. 175 103929 Google Scholar
[18]	Liu X L, Wu Y D, Zheng B Y, Bai R, Gao L, Dong Z, Song C Q, Yu Y, Gao P, Hui X D 2024 Small 20 2403371 Google Scholar
[19]	Yan K, Sun J P, Bai J, Liu H, Huang X, Jin Z Y, Wu Y N 2019 Mater. Sci. Eng. , A 739 513 Google Scholar
[20]	Bo L, Gao X Y, Song W J, Ning Z L, Sun J F, Ngan A H W, Huang Y J 2025 Int. J. Plast. 188 104307 Google Scholar
[21]	Kustra P, Milenin A, Byrska-Wójcik D, Grydin O, Schaper M 2017 J. Mater. Process. Technol. 247 234 Google Scholar
[22]	陆子川, 姜风春, 侯红亮, 刘郢, 程玉洁, 果春焕 2015 塑性工程学报 22 117 Google Scholar Lu Z C, Jiang F C, Hou H L, Liu Y, Cheng Y J, Guo C H 2015 J. Plast. Eng. 22 117 Google Scholar
[23]	Jeong K, Jin S W, Kang S G, Park J W, Jeong H J, Hong S T, Cho S H, Kim M J, Han H N 2022 Acta Mater. 232 117925 Google Scholar
[24]	Wu Z C, Xu X F, Zhao Y, Yan X D, Zhou Y C, Wei L, Yu Y Q 2023 Mater. Sci. Eng. , A 863 144536 Google Scholar
[25]	Li M Q, Shen Y D, Luo K, An Q, Gao P, Xiao P H, Zou Y 2023 Nat. Mater. 22 958 Google Scholar
[26]	Gao X Y, Liu J, Bo L, Chen W, Sun J F, Ning Z L, Ngan W, Huang Y J 2024 Acta Mater. 277 120203 Google Scholar
[27]	Liu Y F, Ren J, Guan S, Li C Y, Zhang Y, Muskeri S, Liu Z Y, Yu D J, Chen Y, An K, Cao Y, Liu W, Zhu Y T, Chen W, Mukherjee S, Zhu T, Chen W 2023 Acta Mater. 250 118884 Google Scholar
[28]	HajyAkbary F, Sietsma J, Bottger A J, Santofimia M J 2015 Mater. Sci. Eng. A 639 208 Google Scholar
[29]	李亦庄, 黄明欣 2020 金属学报 56 487 Google Scholar Li Y Z, Huang M X 2020 Acta Metall. Sin. 56 487 Google Scholar
[30]	Yang B, Motz C, Rester M, Dehm G 2012 Philos. Mag. 92 3243 Google Scholar
[31]	Peng S Y, Tian Y Z, Ni Z Y, Lu S, Li S 2024 Int. J. Plast. 182 104129 Google Scholar
[32]	Liu M W, Gong W, Zheng R X, Li J, Zhang Z, Gao S, Ma C L, Tsuji N 2022 Acta Mater. 226 117629 Google Scholar
[33]	Ben D D, Yang H J, Dong Y A, Tian Y Z, Sun S J, Meng L X, Duan Q Q, Zhang P, Zhang Z F 2023 Mater. Charact. 195 112557 Google Scholar
[34]	秦荣山, 周本濂 1997 材料研究学报 11 69 Qin R S, Zhou B L 1997 Chin. J. Mater. Res. 11 69
[35]	Zhang W, Sui M L, Zhou Y Z, Zhong Y, Li D X 2002 Adv. Eng. Mater. 4 697 Google Scholar
[36]	Liu Y, Fan J F, Zhang H, Jin W, Dong H B, Xu B S 2015 J. Alloys Compd. 622 229 Google Scholar
[37]	Zhang X, Li H W, Shao G D, Gao J, Zhan M 2022 J. Alloys Compd. 898 162762 Google Scholar
[38]	Li X, Zhu Q, Hong Y R, Zheng H, Wang J, Wang J W, Zhang Z 2022 Nat. Commun. 13 6503 Google Scholar
[39]	Cao W D, Sprecher A F, Conrad H 1989 J. Phys. Sci. Instrum. E 22 1026 Google Scholar

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