Research progress of polymers with high thermal conductivity

Liu Yu-Rui; Xu Yan-Fei

doi:10.7498/aps.71.20211876

Abstract

Developing thermally conductive polymers is of fundamental interest and technological importance. Common polymers have low thermal conductivities on the order of 0.1 W·m^–1·K^–1 and thus are regarded as thermal insulators. Compared with the traditional heat conductors (metals and ceramics), polymers have unparalleled combined properties such as light weight, corrosion resistance, electrical insulation and low cost. Turning polymer insulators into heat conductors will provide new opportunities for future thermal management applications. Polymers may replace many metals and ceramics, serving as lightweight heat dissipators in electronics, refrigerators, and electrical vehicles.In this review and perspectives, we discuss the research progress of thermal transport mechanisms in polymers and reveal the relations between thermal conductivity and polymer structural parameters such as bond strength, crystallinity, crystallite size, chain orientation, radius of gyration, and molecular weight. We discuss the advanced strategies for developing thermally conductive polymers by both bottom-up and top-down approaches. We highlight how thermally conductive polymers provide new opportunities for thermal management applications. Finally, we emphasize the future challenges to and opportunities for designing and synthesizing polymers with metal-like thermal conductivity and exploring the thermal transport physics in polymers. We believe that the thermally conductive polymers with their unparalleled combination of characteristics (light weight, electrical insulation, easy processability, corrosion resistance, etc.) promise to possess many existing and unforeseen thermal management applications.

Keywords:

thermally conductive polymers /
thermal conductivity /
thermal transport mechanisms in polymers /
thermal management applications

Authors and contacts

Liu Yu-Rui¹,
Xu Yan-Fei^1,2

1.
Mechanical & Industrial Engineering Department, University of Massachusetts Amherst, Amherst 01003, USA
2.
Chemical Engineering Department, University of Massachusetts Amherst, Amherst 01003, USA

Corresponding author: Xu Yan-Fei, yanfeixu@umass.edu

Funds: Project supported by the Faculty Startup Fund Support from University of Massachusetts Amherst, USA

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References

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Cited By

图 1 微纳尺度及原子尺度下的高分子结构. 高分子链端、无定型链、链缠结、杂质等缺陷都可能成为热载流子散射点, 导致高分子聚合物高分子的热导率比较低 (约0.1 W·m^–1·K^–1)^[24]

Figure 1. Polymer structures at micro-nano scale and atomic scale. Defects such as chain ends, amorphous chains, chain entanglement, impurities in polymers act as heat carrier scattering sites and hinder efficient thermal transport, result in relatively low thermal conductivity (about 0.1 W·m^–1·K^–1)^[24].

DownLoad: Full-Size Img PowerPoint

图 2 室温下聚乙烯(PE)的热导率实验数据^{[21,38,39,43-50,58,83,87,94-97]}及模拟值^[35,54,98]; 室温下聚噻吩(PT)的热导率实验数据^{[39,40,99,100]}及模拟值^[56]

Figure 2. Thermal conductivities of polyethylene at room temperature in experimental measurements^{[21,38,39,43-50,58,83,87,94-97]}and simulations^[35,54,98]. Thermal conductivities of polythiophene at room temperature in experimental measurements^{[39,40,99,100]}and simulations^[56].

DownLoad: Full-Size Img PowerPoint

[1]	Moore A L, Shi L 2014 Mater. Today 17 163 Google Scholar
[2]	Schelling P K, Shi L, Goodson K E 2005 Mater. Today 8 30
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